Equipment Parameters
|
Power Supply |
220V 50HZ |
|
Electric Current |
6.3A |
|
Plate diameter |
300mm, 350mm, 420mm |
|
Plate speed |
0-120rpm (range can be adjusted) |
|
Jig rotation speed |
0-120rpm (range can be adjusted) |
|
Work Time |
0-10 hours |
|
Acceptable Wafer Size |
3 inches, 4 inches, 6 inches |
Introduction
An Abrasive Autofeed Cylinder is a type of industrial finishing tool used in automated grinding, polishing, or lapping processes.
Applications
Metal Processing
Used for grinding, polishing, and finishing metal components to achieve smooth surfaces and precise dimensions.
Glass and Ceramic Finishing
Removes surface defects, scratches, and prepares substrates for further processing or coating.
Semiconductor and Electronics Manufacturing
Polishes wafers or electronic components with uniform material removal and minimal damage.
After-sales Service
Speedy Technical Consultation
24/7 expert support provides real-time guidance to optimize polishing disc speed, pressure, and slurry flow for perfect wafer flatness.
Worry-Free Quality Assurance
Defective polishing layers or substrates are replaced free during warranty, with ongoing quality optimization for reliable use.
Exclusive Customization Service
Tailored polishing discs ensure perfect adaptation to your materials, chip structures, and process requirements.
Comprehensive Training Services
Operators master polishing principles, usage, maintenance, and troubleshooting through online, offline, and on-site training.
Timely Supply of Accessories
Fast shipping within 24 hours and high-quality, fully compatible accessories minimize downtime and maintain production continuity.
Company Introduction
Hemei Semiconductor focuses on advanced compound semiconductor polishing equipment and process R&D, achieving nanometer-level precision with intelligent, high-standard production systems. Its fourth-generation polishing technology improves material removal rates, efficiency, and yield across materials such as infrared, ultra-wide bandgap, and optoelectronics. Supported by a skilled, multidisciplinary team and strategic industry collaborations, Hemei is positioned as a global leader driving the future of precision semiconductor processing.
FAQ
Q: What are the key specifications buyers should consider?
A: Buyers typically focus on cylinder diameter, stroke length, feed speed, load capacity, material compatibility, and durability to ensure optimal performance for specific grinding or polishing applications.
Q: How does the autofeed function benefit the grinding process?
A: The autofeed feature ensures uniform pressure and controlled feed rate, reducing operator intervention, improving surface consistency, and minimizing human error during repetitive grinding or polishing tasks.
Q: How should Abrasive Autofeed Cylinders be maintained for long-term use?
A: Regular cleaning, lubrication, and inspection of seals and moving parts are essential. Ensure proper alignment and avoid overloading to maintain performance, accuracy, and lifespan.
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