Your Professional Lapping Polishing Machine Supplier

 

HISEMI TECHNOLOGY(BEIJING) LTD. is composed of a Team of scientists with over 15 years of technical experience and personnel with years of market operation experience.Core technical personnel have applied for over 50 patents at various levels. Some Engineers have many years experiences handling Logitech PM5,PM6 and LP50 lapping & Polishing machines.We have provided equipment and cutting-edge processes for scientific research units such as the Institute of Semiconductors of the Chinese Academy of Sciences, Peking University etc.We have more than 20 experts to develop more than 60 different kinds of function assembly to match customers technical requirement.

 
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Why Choose Us

Product Application

Our machines can be used in many technical applications, such as Semiconductors, Optics, Optoelectronics, Geological sciences.

Global Shipping

Widely cooperating in the market, our products sell well both domestically and internationally, and have a good reputation in the semiconductor industry.

Our Certificate

Technical team has more than 50 patens, including CZT&MCT process patens, special angle of optical fiber polishing, etc.

Professional Team

The employee team is composed of professional elites from multiple fields such as mechanical manufacturing, electronic engineering, and materials science.

 

Advantages of Lapping Polishing Machine
 

Thickness Identity
Lapping allows for much tighter thickness tolerance. Raw materials that have been dry pressed or tape cast, often referred to as “as-fired”, typically have a thickness tolerance of 10%. Standard lap thickness tolerance is +/-.0005”/” and can be as tight as .00005”/” depending on the length, width and thickness of the part or substrate.

 

Surface Finish
The surface finish of as-fired materials is usually specified in micro-inch max parameters. As a result, the manufacturer can get away with large surface finish variation within batches. Our various abrasives and unique proprietary processes allow for better control over the finish.

 

Part Uniformity
As we all know, having uniform parts is crucial for producing repeatable results. Precision lapping provides excellent control to ensure uniform pieces within specified parameters.

 

Flatness
Lapping controls the flatness of your parts or substrates. For information on flatness keep your eyes peeled for our upcoming article on camber, flatness and parallelism or contact us with questions.

 

Camber Reduction
Precision lapping aids in the removal of deviation, bow and warp on a substrate. Typical substrates in as-fired condition have camber specifications of .002” to .003” inch per inch. Lapping or polishing substrates will decrease camber to .0005”/”.

 

Parallelism
Achieving parallelism between faces on a substrate can be very important. Lapping is a great way to guarantee parallelism to extremely tight tolerances.

 

Preparation for Polishing
Precision lapping is used in the preparation of any part or substrate to be polished. The parts go through various lapping abrasives to reduce the subsurface damage before moving on to the precision polishing process.

 

Specifications

 

Power

AC 110V and 208-240V (50/60Hz) switchable for worldwide operation.

Features

· One cast iron plate for lapping and one cast aluminum plate for polishing

· Two rocking workstations with wafer holders and condition rings can be controlled independently for polishing 2 pcs of 3" wafers in one running.

Super-Flat 8" Lapping Plate

Flatness < 2.5 micron / inch²

Plate Run-off

< 5 micron

Aluminum Case

Heavy Duty Cast with Bright Painting (Color: Black)

Two Work Stations Rocking Speed

8° Rocking with an adjustable speed of 0 - 20 rocking/minute

Two Flat Sample Holders

80 Dia. x 35 T mm for carrying <3" diameter wafer

Two Condition Rings

95 O.D. x 88 I.D. x 32 T mm

Master Plate Speed Range

0 ~ 250 rpm variable with digital display

Operation Timer

0 - 99 hours

Motor

300 W high torque DC motor

Dimensions

525 L x 350 W x 325 H (mm)

Net Weight

120 lbs

Optional Automatic Slurry Feeder

· Automatic slurry feeder SKZD-2 is not included

· The plastic rolling container can take the volume of slurry up to 1.0 Gallon (~3.8L) for a long time polishing

Optional Parts

· 2" Polishing Fixture for Precision / Automatic Thinning and Polishing

· Polishing Sample Holder with Three 1" Holes for high throughput polishing  (2 x 3 sample)

· 8'' high purity ceramic lapping plate

Warranty

· One year limited warranty with lifetime support

· Rusting and damage due to improper storage condition or maintenance are not covered by warranty

Package Dimensions

40" x 38" x 30"

Shipping Weight

185 lbs

Applications

Polishing machine applications

 

Lead time

 

 

Quantity (sets)

1 - 3

> 3

Lead time (days)

15

To be negotiated

 

Packaging & Shipping

 

productcate-733-342

 

FAQ

Q: What is the purpose of a lapping machine?

A: A lapping machine is a specialised machine used for generating very fine surface finishes on a workpiece. It is used in a variety of industries, including aerospace, automotive, and medical, where precise surface finishes are required.

Q: What is the difference between lapping and polishing?

A: Lapping produces a rough surface processed with coarse abrasives and a hard plate tool, while polishing produces a mirror-like surface processed with fine particle abrasives and soft pads.

Q: What is lapping and polishing basics?

A: Lapping is a method of efficiently processing into the desired shape and quality by using hard tools and abrasive grains that are 0ver 10 um. Polishing refers to using small abrasive grains that are less than 10 um and a soft tool (polisher) such as felt or plastic to smooth the rough surface after grinding.

Q: Is buffing and polishing the same thing?

A: The main difference between buffing and polishing is the level of abrasion used. Buffing is more aggressive and uses an abrasive compound to clear away marks and scratches while polishing is less intense and uses a smoother abrasive material to create a shiny, reflective surface.

Q: What is the difference between a buffing machine and a polishing machine?

A: Both processes require a rotary or dual-action polisher but differ in the type of pads and compounds used. Buffing uses coarser pads and more abrasive compounds to remove deeper imperfections, while polishing uses finer pads and polishes to create a high shine.

Q: Which is better, orbital or rotary polisher?

A: Safety and Ease of Use: Orbital polishers are much safer for vehicle paint compared to rotary polishers. They won't burn through your paint or clear coat, which is particularly important for darker-colored vehicles where flaws are more visible.

We're well-known as one of the leading lapping polishing machine manufacturers in China. If you're going to buy discount lapping polishing machine, welcome to get pricelist from our factory. Also, customized service is available.

Gallium III Oxide Lapping Polishing Machine, Single Crystalline Diamond Lapping Polishing Machine, Single Side Lapping Polishing Machine
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