Equipment Parameters
|
Power Supply |
220V 50HZ |
|
Electric Current |
6.3A |
|
Plate diameter |
300mm, 350mm, 420mm |
|
Plate speed |
0-120rpm (range can be adjusted) |
|
Jig rotation speed |
0-120rpm (range can be adjusted) |
|
Work Time |
0-10 hours |
|
Acceptable Wafer Size |
3 inches, 4 inches, 6 inches |
Introduction
The most typical application of a pure chemical polishing machine is the final chemical etching and polishing of the following materials:
● Cadmium zinc telluride, indium antimonide, and mercury cadmium telluride used in infrared detection and other devices.
● With or without microcircuit or other device structures, thin or ultra-thin III-V group,
Group II-VI compound semiconductor materials.
●Indium phosphide, cadmium sulfide, and similar optoelectronic materials.
Features
It can process thin and fragile II-VI and III-V semiconductor wafers, such as silicon, silicon carbide, gallium nitride,
Gallium arsenide, indium phosphide, cadmium zinc telluride, cadmium mercury telluride, etc. These materials require high-quality samples and reduced
Breakage of expensive materials during preparation.
Company Introduction
HISEMI Technology (Beijing) Ltd. is committed to promoting the development of compound semiconductor grinding and polishing equipment, focusing on developing cutting-edge processes and constantly breaking through the industry's technological boundaries.
The state-of-the-art production facility is meticulously designed to meet modern, intelligent manufacturing standards. It features a scientifically optimized layout with clearly defined production areas. The integration of advanced equipment and proprietary intelligent control systems showcases the company's technological strength. For instance, HISEMI's high-precision grinding machines achieve exceptional flatness control, maintaining grinding disc flatness errors within less than 2 nanometers. This precision lays a solid foundation for producing top-tier equipment.
HISEMI Technology (Beijing) Ltd. remains committed to becoming a global leader in semiconductor grinding and polishing equipment, driving the evolution of precision processing for semiconductor materials.
FAQ
Q: What Industries Use Precision Polishing Machines?
A: Precision Polishing Machines are essential in industries such as semiconductor manufacturing, optics, electronics, aerospace, automotive, and medical device production. They are used to achieve high surface quality and meet strict dimensional tolerances.
Q: How Does a Precision Polishing Machine Work?
A: The machine uses a rotating polishing pad, along with a polishing slurry or compound, to gradually remove surface material. Pressure, speed, and polishing time are precisely controlled to achieve the desired surface finish.
Q: What Materials Can Be Polished Using a Precision Polishing Machine?
A: It can polish a wide range of materials, including metals (e.g., stainless steel, aluminum), ceramics, glass, semiconductors (e.g., silicon wafers), optical lenses, and composite materials.
Q: What Are the Benefits of Using a Precision Polishing Machine?
A: Benefits include consistent surface quality, improved optical clarity, reduced surface roughness, enhanced durability, and minimized material wastage. It also enables precise control over polishing parameters for customized results.
Q: How Is Surface Quality Measured After Polishing?
A: Surface quality is typically measured using surface roughness parameters (e.g., Ra, Rz) and optical inspection methods. In semiconductor and optical applications, interferometers and profilometers are used to assess flatness and smoothness.
Q: What Is the Difference Between Grinding and Polishing?
A: Grinding removes larger amounts of material quickly to shape or prepare surfaces, while polishing involves finer abrasives and controlled processes to create a smooth, reflective finish. Polishing is often the final step after grinding.
Q: How Can a Precision Polishing Machine Improve Production Efficiency?
A: Automated precision polishing machines reduce manual labor, improve consistency, and shorten processing times. They ensure repeatable results, minimize defects, and enhance overall productivity, especially in high-volume manufacturing.
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