HISEMI TECHNOLOGY(BEIJING) LTD. is composed of a Team of scientists with over 15 years of technical experience and personnel with years of market operation experience.Core technical personnel have applied for over 50 patents at various levels. Some Engineers have many years experiences handling Logitech PM5,PM6 and LP50 lapping & Polishing machines.We have provided equipment and cutting-edge processes for scientific research units such as the Institute of Semiconductors of the Chinese Academy of Sciences, Peking University etc.We have more than 20 experts to develop more than 60 different kinds of function assembly to match customers technical requirement.
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![Silicon Carbide Powders]()
Silicon Carbide PowdersHigh hardness：The Mohs hardness is 9.2 - 9.5, second only to diamond. This makes it perform well in applications such as grinding and cutting, and it can effectively grind and process hard materials.view more -
![Aluminium Oxide Powders]()
Aluminium Oxide PowdersAppearance: It is usually a white or off white amorphous powder, and its particle size and shape may vary depending on different preparation methods and process conditionsview more -
![Cerium Oxide Powders]()
Cerium Oxide PowdersAppearance: It is usually a white or slightly yellow powder, and as the purity increases, the color becomes closer to white.view more
Density: The density is relatively high, about 7.13 g/cm ³, which gives it an advantage in some... -
![Boron Carbide Powders]()
Boron Carbide PowdersHigh hardness: Boron carbide has a hardness second only to diamond and cubic boron nitride, with a Mohs hardness of 9.3. This makes it excellent in grinding, cutting, and other fields, and can effectively process various hard materials.view more -
![Diamond Suspensions]()
Diamond SuspensionsHigh hardness: Diamond has an extremely high hardness, with a Mohs hardness of up to 10, which can effectively grind and cut various materials and perform well in grinding and polishing processes.view more -
![Thin Film Bonding Wax]()
Thin Film Bonding WaxThin film adhesive wax is suitable for the bonding process of optical glass, sapphire, crystal, semiconductor materials such as silicon wafers, germanium wafers, silicon carbide, lithium niobate, lithium tantalate, metals, piezoelectric...view more -
![High Melting Point Thin Film Bonding Wax]()
High Melting Point Thin Film Bonding WaxHigh temperature thin film adhesive wax is suitable for the bonding process of optical glass, sapphire, crystal, semiconductor materials such as silicon wafers, germanium wafers, silicon carbide, lithium niobate, lithium tantalate,...view more -
![Quartz Wax]()
Quartz WaxSemiconductor quartz wax is carefully developed for key processes in semiconductor manufacturing, and is a functional material with excellent performance. It is synthesized with a unique formula and advanced technology, which can meet...view more -
![Wax Liquid]()
Wax LiquidHigh viscosity stability: Liquid wax has excellent viscosity stability, with minimal viscosity changes under different temperature and process conditions. This feature ensures that liquid wax can maintain a uniform coating thickness and...view more -
![Unlapped Glass Substrate]()
Unlapped Glass SubstrateThe roughness range is set between Ra 0.5-1.5 μ m, which is conducive to the adhesion and uniform distribution of abrasive particles, ensuring the efficiency of the grinding process, and avoiding excessive scratching and damage to the...view more -
![Corrosion-resistant Glass Substrate]()
Corrosion-resistant Glass SubstrateUsing a special formula of glass material, it undergoes high-temperature melting and special chemical treatment processes, making it highly resistant to common acid-base and other chemical reagents. Whether in a highly acidic grinding...view more -
![Chemcloth Polishing Cloth]()
Chemcloth Polishing ClothPure chemical polishing pads are made of special chemical synthetic materials, and the surface contains abundant active chemical groups. These functional groups can undergo specific chemical reactions with the surface of the polished...view more
Why Choose Us
Product Application
Our machines can be used in many technical applications, such as Semiconductors, Optics, Optoelectronics, Geological sciences.
Global Shipping
Widely cooperating in the market, our products sell well both domestically and internationally, and have a good reputation in the semiconductor industry.
Our Certificate
Technical team has more than 50 patens, including CZT&MCT process patens, special angle of optical fiber polishing, etc.
Professional Team
The employee team is composed of professional elites from multiple fields such as mechanical manufacturing, electronic engineering, and materials science.
Advantages of Silicon Carbide Powders
High Hardness and Strength
One of the most significant advantages of silicon carbide powder is its exceptional hardness and strength. Rated at 9.0-9.5 on the Mohs scale, silicon carbide powder is harder than most other industrial powders, including aluminum oxide and silica powder.
Thermal Conductivity
Silicon carbide powder is renowned for its excellent thermal conductivity, which is significantly higher than that of many other industrial powders.
Chemical Resistance
Another key advantage of silicon carbide powder is its outstanding chemical resistance. This property makes it suitable for use in harsh industrial environments where exposure to corrosive chemicals or extreme temperatures is common.
Cost-effectiveness
While silicon carbide powder may have a higher initial cost compared to some other industrial powders, its overall cost-effectiveness cannot be overlooked.
Versatility in Applications
Silicon carbide powder is incredibly versatile, finding applications across a wide range of industries. Its unique properties make it suitable for use in electronics, automotive, steel production, and many other sectors.
Advantages of Diamond Suspensions
Particle Size and Concentration
The particle size and concentration in the suspension should match the precision and finish requirements of the project. Fine grit sizes (1-3 microns) are typically used for achieving high finishes, while coarser grits (6-30 microns) are suitable for rapid material removal.
Viscosity and Vehicle
The fluid medium or vehicle used in the suspension affects how the diamond particles are dispersed and maintained during polishing.
Compatibility with Polishing Pads
The choice of diamond suspension should also consider the type of polishing pads used. Certain pads may work better with monocrystalline or polycrystalline suspensions based on their material and texture.
Specific Application Needs
Consider any specific requirements such as non-contaminating or chemically inert suspensions, especially in applications like semiconductor fabrication or optical lens polishing where material purity is critical.
Thermal Stability
Diamond suspensions must maintain their integrity and performance under the thermal loads typically encountered during polishing processes. Monocrystalline diamonds, with their more robust structure, generally exhibit superior thermal stability.
Chemical Compatibility
Certain polishing tasks may involve exposure to chemicals, either from the material being polished or from the environment.
Parameters of Silicon Carbide Powders
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Compound Formula |
SiC |
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Tensile Strength |
210 to 370 MPa (Ultimate) |
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Thermal Conductivity |
120 to 170 W/m-K |
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Thermal Expansion |
4.0 to 4.5 µm/m-K |
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Electrical Resistivity |
1 to 4 10x Ω-m |
Specifications of Silicon Carbide Powder
|
Density |
3.15-3.20 g/cm3 |
|
Elastic Modulus |
400-450 Gpa |
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Hardness |
2300-2850 HV(0.3) Kg/mm2 |
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Fracture Toughness |
3.5-4.3 MPa.m1/2 |
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Electrical Resistivity |
100-107 ohm-cm |
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Particle Size |
200~25000 mesh |
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Color |
Black or Green |
Applications of Silicon Carbide Powder
Semiconductor Manufacturing: High purity SiC powder is used to produce high-quality wafers and substrates for semiconductor devices, including power electronics, LEDs, and other optoelectronic components.
Abrasives and Cutting Tools: Used in the production of high-performance abrasives and cutting tools. SiC powder’s hardness and thermal stability make it suitable for grinding, polishing, and cutting hard materials like metals, ceramics, and glass.
Ceramic Materials: Utilized in the production of advanced ceramics for applications requiring high strength, thermal stability, and wear resistance. This includes components for industrial machinery, aerospace, and automotive industries.
Composites: Incorporated into composite materials to enhance their mechanical properties. SiC powder is used in metal matrix composites (MMCs) and polymer matrix composites (PMCs) to improve strength, thermal conductivity, and wear resistance.
Refractories: Employed in refractory materials for furnaces, kilns, and other high-temperature processing equipment. SiC’s high thermal conductivity and resistance to thermal shock and chemical corrosion make it ideal for these applications.
Nuclear Applications: Used in nuclear reactors as a material for fuel cladding and other components. SiC’s ability to withstand high radiation environments and its low neutron absorption cross-section is advantageous in these settings.
Application of Diamond Suspensions
Optics: Used for polishing lenses, mirrors, and other optical components to achieve high clarity and precision.
Electronics: In the manufacturing of semiconductors and electronic components, diamond suspensions are used for wafer thinning and finishing.
Automotive: Diamond suspensions are used in the production of components like fuel injectors and engine parts, where precision is key to functionality.
Jewelry: For cutting and polishing gemstones, including diamonds, diamond suspensions offer the ability to create flawless, intricate designs.
Transportation
We're well-known as one of the leading lapping and polishing consumable manufacturers in China. If you're going to buy discount lapping and polishing consumable, welcome to get pricelist from our factory. Also, customized service is available.
Unlapped Glass Substrate, Ethane Diol Polishing Fluid
