Wax Liquid

High viscosity stability: Liquid wax has excellent viscosity stability, with minimal viscosity changes under different temperature and process conditions. This feature ensures that liquid wax can maintain a uniform coating thickness and stable adhesion during the wafer thinning process, providing reliable support and protection for the wafer.

Good wettability: It has excellent wettability on the surface of the wafer and can quickly and uniformly spread on the wafer surface, forming a tightly adhered protective film. This good wettability helps to improve the adhesion between liquid wax and the wafer, preventing the wax layer from falling off or sliding during the thinning process.

Strong thermal stability: can withstand high temperatures without decomposition, deterioration, or performance degradation. In the process of wafer thinning, there is often a certain degree of heating or heat dissipation involved. The thermal stability of liquid wax enables it to maintain stable performance under these temperature changes, ensuring the smooth progress of the entire thinning process.

Low volatility and low residue: The volatilization amount is extremely low during use, reducing the loss of wax and environmental pollution caused by volatilization. At the same time, after completing wafer thinning, through appropriate cleaning processes, liquid wax can be almost completely removed without leaving difficult to clean residue on the wafer surface, avoiding any impact on subsequent semiconductor manufacturing processes.

Rapid curing characteristics: Under specific conditions (such as cooling or adding curing agents), it can quickly transform from liquid to solid, forming a support layer with a certain strength. This rapid solidification characteristic enables the position of the wafer to be quickly fixed during the wafer thinning process, improving processing efficiency.

Silicon wafer thinning: widely used in the thinning process of silicon wafers. During the process of reducing the thickness of silicon wafers to the required specifications, liquid wax can effectively protect the circuit and device structures on the wafer surface, preventing damage during grinding and polishing.

Thinning of compound semiconductor wafers: For compound semiconductor wafers such as silicon carbide (SiC) and gallium nitride (GaN), due to their material properties and processing difficulties, the special properties of liquid wax can better meet their support and protection needs during the thinning process, ensuring high-quality processing results.

Wafer thinning in advanced packaging: In advanced packaging technologies such as flip chip packaging and fan out packaging, the precision and quality requirements for wafer thinning are extremely high. Liquid wax can provide reliable fixation and protection for wafers in these complex packaging processes, helping to achieve finer chip manufacturing and packaging.

Professional after-sales service: installation team, escort

Hemei Semiconductor is well aware that high-quality products cannot be achieved without comprehensive after-sales service. The company's after-sales installation team is composed of a group of experienced and skilled professionals. During the equipment installation process, they fully demonstrated their professional abilities and rigorous attitude.

From mechanical structure debugging of equipment, to electrical system testing, to calibration and testing of various operating parameters, every link is strictly controlled. They do not overlook any details that may affect the normal operation of the equipment, ensuring that the equipment can be put into use in its best condition after installation. This professional after-sales support provides reliable guarantees for customers' production and operation, allowing them to have no worries.

Looking ahead to the future, Hemei Semiconductor (Beijing) Technology Co., Ltd. will continue to uphold the spirit of innovation and deepen its cultivation in the field of semiconductor material grinding and polishing. With its outstanding technological advantages and professional services, it will inject continuous power into the development of the semiconductor industry and lead the industry towards a more brilliant future.

Hemei Semiconductor (Beijing) Technology Co., Ltd.: A shining pearl in the field of semiconductor grinding and polishing

In the grand map of the semiconductor industry, Hemei Semiconductor (Beijing) Technology Co., Ltd. has established a remarkable monument with its unremitting efforts and excellent technology in the field of semiconductor material grinding and polishing.

Outstanding achievements in multiple fields

Semiconductor substrate materials: finely crafted, laying the foundation

The high-precision grinding and polishing technology of Hemei Semiconductor can be regarded as a "stroke of genius" in the processing of semiconductor substrate materials. At this critical stage, the company's technical team controls with extreme precision and meticulously carves the surface of each substrate material. Through advanced processes and equipment, atomic level flatness and uniformity control of material surfaces have been achieved. This not only provides a nearly perfect foundation for subsequent wafer manufacturing, but also greatly reduces the product defect rate caused by substrate defects, ensuring the high quality of semiconductor products from the source.

Wafer manufacturing: precise control to improve quality

In the wafer manufacturing process, precise control of temperature and pressure is a key factor determining the quality and performance of the wafer. Hemei Semiconductor, with its advanced technology, acts like a precise conductor to finely regulate these two key parameters. By precise setting and real-time monitoring, fine processing of wafers has been achieved, resulting in a nanometer level error range in wafer size accuracy and greatly improving surface quality. This outstanding technological capability provides a solid guarantee for manufacturing high-performance and highly integrated chips.

Semiconductor devices: finely polished to create excellence

The performance and reliability of semiconductor devices directly affect the overall quality of the semiconductor product. The high-precision grinding and polishing process of Hemei Semiconductor has played a crucial role in this field. Like a skilled craftsman, he meticulously processes semiconductor devices like micro carving. By removing small defects on the surface of the device and optimizing its microstructure, the performance and reliability of the device have been significantly improved. This enables devices manufactured using Hemei Semiconductor technology to perform outstandingly in various electronic products, providing core support for the stable operation of the products.

Advanced Packaging: Innovative Customization, Leading the Trend

Advanced packaging technology is one of the important advantageous areas of Hemei Semiconductor. The company has achieved efficient packaging of chips through innovative packaging processes, creating a perfect "armor" for the chips. Moreover, Hemei Semiconductor fully considers the personalized needs of different customers and provides them with customized packaging solutions. Whether it is for the heat dissipation needs of high-power chips or the high-density packaging requirements of small-sized chips, Hemei Semiconductor can tailor the most suitable solutions with its rich experience and strong technical strength, helping customers stand out in the fierce market competition.

MEMS field: Ultra precision machining, breaking through limits

In the cutting-edge field of MEMS, Hemei Semiconductor's ultra precision planar processing technology has become a key tool to overcome challenges. By precisely controlling the pressure and temperature during the machining process, MEMS devices can be processed with high precision. This technology breaks through the limitations of traditional processing techniques and achieves precise manufacturing of micro structures in MEMS devices, providing strong support for the widespread application of MEMS technology in many fields such as sensors and actuators.

Industry innovation: high-precision grinding and polishing process for fourth generation semiconductor materials

The high-precision grinding and polishing process of the fourth generation semiconductor materials independently developed by Hemei Semiconductor is undoubtedly a major innovation in the industry. This technology successfully solves the problem of difficult MRR (Material Removal Rate) improvement in traditional grinding and polishing processes by precise back pressure control and high-speed stable operation of the grinding and polishing disc, real-time and accurate adjustment of sample pressure and grinding and polishing fluid supply during the process.

The application of this technology is like injecting a powerful "accelerator" into the grinding and polishing process of semiconductor materials. On the one hand, it significantly improves the yield rate of products, elevates the quality of processed semiconductor materials, reduces scrap rates, and lowers production costs; On the other hand, it significantly improves processing efficiency, shortens production cycles, and enables enterprises to respond to market demand faster, seizing market opportunities.

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