Hisemi Technology (Beijing) Co., Ltd. is composed of a team of scientists with more than 15 years of technical experience and personnel with many years of market operation experience. The core technical personnel have applied for more than 50 patents at various levels, and some engineers have many years of experience in operating Logitech PM5, PM6, and LP50 lapping and polishing machines.
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+ Team Members
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+ Years of Experience
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+ Patent Technology
Hisemi: An innovative leader in semiconductor lapping and polishing
- Lapping Machine
- CMP Machine
- CMP Machine
- Logitech PM5
Popular Products
High-quality products, superb technology.
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![Chemical Polishing Machine]( "Chemical Polishing Machine")
Chemical Polishing MachineThe pure chemical polishing machine combines the advantages of physical and chemical process methods, with physical process methods providing advanced...
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![chemical mechanical polishing]( "chemical mechanical polishing")
chemical mechanical polishingHigh precision lapping system: adopting advanced lapping disc design, its material has been specially treated to have extremely high wear resistance and...
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![polishing machine]( "polishing machine")
polishing machineAdopting advanced lapping disc materials and unique design, coupled with high-precision motor drive, the lapping accuracy can reach nanometer level. It can...
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![Wafer Lapping Polishing Machine]( "Wafer Lapping Polishing Machine")
Wafer Lapping Polishing MachineIn the field of semiconductor manufacturing, wafer lapping and polishing are key steps to ensure chip performance. With its profound technological...
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Our Industry Services
It is determined to become a trusted strategic partner in the global semiconductor industry and contribute to the vigorous development of the semiconductor industry.
Lapping Polishing Machine
The equipment can also be outfitted with an online real-time monitoring system (e.g., pressure, speed, temperature) to guarantee process stability and high-quality outcomes.
lapping and Polishing Accessories
The cast iron disc repair block carefully crafted by Hemei Semiconductor for polishing and polishing machines is the core component that ensures high precision and stability in the polishing process.
Lapping Powders
It has strong technical capabilities in the semiconductor material substrate thinning and polishing process, and can provide solid technological support for your subsequent device preparation and packaging processes.
Bonding Wax
Thin film adhesive wax is suitable for the bonding process of optical glass, sapphire, crystal, semiconductor materials such as silicon wafers, germanium wafers, silicon carbide, lithium niobate, lithium tantalate, metals, piezoelectric ceramics, etc. in the grinding and polishing process.
Glass Substrates
The roughness range is set between Ra 0.5-1.5 μ m, which is conducive to the adhesion and uniform distribution of abrasive particles, ensuring the efficiency of the grinding process, and avoiding excessive scratching and damage to the surface of the processed material due to excessive roughness.
Our Product Advantages
Adhering to the concept of innovation and quality, Hemei Semiconductor provides high-quality equipment and solutions for the global manufacturing industry.
HISEMI TECHNOLOGY（BEIJING） Ltd.: Innovation Leader in Semiconductor Lapping and Polishing Field
Comprehensive technological advantages empower all aspects of semiconductor production
Contact Us Semiconductor substrate materials: laying the foundation for high-quality products
As the foundation of the entire semiconductor manufacturing process, the quality of semiconductor substrate materials is crucial. With high-precision lapping and polishing technology, Hemei Semiconductor is like a skilled craftsman, meticulously carving the surface of each substrate material. By precise control, the atomic level flatness and uniformity of the material surface have been achieved, providing an almost perfect "canvas" for subsequent wafer manufacturing, greatly reducing subsequent problems caused by substrate surface defects, and ensuring the quality of semiconductor products from the source.
Hisemi Technology Wafer Manufacturing: Improving Quality and Performance
In the complex and critical process of wafer manufacturing, the advanced technology of Hemei Semiconductor is like a precise conductor, regulating the temperature and pressure during the processing step step by step. By precisely setting each parameter, precise processing of the wafer has been achieved, resulting in a nanometer level error range in the size accuracy of the wafer. At the same time, the surface quality has been significantly improved, making the wafer like a beautiful work of art, providing a solid guarantee for manufacturing high-performance chips.
Hisemi Technology Semiconductor Devices: Achieving Excellent Performance and Reliability
The performance and reliability of semiconductor devices directly affect the overall quality of the semiconductor product. The high-precision lapping and polishing process of Hemei Semiconductor plays a key role here, like a delicate surgical knife, performing micro carving on devices. By removing small defects on the surface of the device and optimizing its microstructure, the performance of the device is significantly improved, and the reliability is greatly enhanced, providing core support for the stable operation of electronic products.
Hisemi Technology News Center
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