HISEMI TECHNOLOGY(BEIJING) LTD. is composed of a Team of scientists with over 15 years of technical experience and personnel with years of market operation experience.Core technical personnel have applied for over 50 patents at various levels. Some Engineers have many years experiences handling Logitech PM5,PM6 and LP50 lapping & Polishing machines.We have provided equipment and cutting-edge processes for scientific research units such as the Institute of Semiconductors of the Chinese Academy of Sciences, Peking University etc.We have more than 20 experts to develop more than 60 different kinds of function assembly to match customers technical requirement.
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Thin Film Bonding WaxThin film adhesive wax is suitable for the bonding process of optical glass, sapphire, crystal, semiconductor materials such as silicon wafers, germanium wafers, silicon carbide, lithium niobate, lithium tantalate, metals, piezoelectric...view more
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High Melting Point Thin Film Bonding WaxHigh temperature thin film adhesive wax is suitable for the bonding process of optical glass, sapphire, crystal, semiconductor materials such as silicon wafers, germanium wafers, silicon carbide, lithium niobate, lithium tantalate,...view more
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Quartz WaxSemiconductor quartz wax is carefully developed for key processes in semiconductor manufacturing, and is a functional material with excellent performance. It is synthesized with a unique formula and advanced technology, which can meet...view more
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Wax LiquidHigh viscosity stability: Liquid wax has excellent viscosity stability, with minimal viscosity changes under different temperature and process conditions. This feature ensures that liquid wax can maintain a uniform coating thickness and...view more
Why Choose Us
Product Application
Our machines can be used in many technical applications, such as Semiconductors, Optics, Optoelectronics, Geological sciences.
Global Shipping
Widely cooperating in the market, our products sell well both domestically and internationally, and have a good reputation in the semiconductor industry.
Our Certificate
Technical team has more than 50 patens, including CZT&MCT process patens, special angle of optical fiber polishing, etc.
Professional Team
The employee team is composed of professional elites from multiple fields such as mechanical manufacturing, electronic engineering, and materials science.
Advantages of Bonding Wax
High viscosity and durability
The adhesive wax has high viscosity, can form a stable bond with the substrate, is resistant to high temperature and oxidation, and is suitable for the adhesion of various materials.
High tolerance
The adhesive wax can withstand harsh environments such as high temperature, high humidity, acid and alkali, and maintain its adhesion and precision.


Excellent water resistance
The adhesive wax is not easily affected by moisture, has excellent corrosion resistance, and is suitable for use in humid environments.
Environmental performance
The adhesive wax does not release harmful substances, meets environmental protection standards, and can be used with confidence.
Description
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Type: |
Grinding abrasive |
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Abrasive particle size: |
Mirror polishing fine polishing |
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Color: |
White |
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Material: |
Mix quartz sand and fine alumina,Alumina |
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Application: |
Polish various stainless steel, aluminum, copper, glass, jewelry, musical instrument surfaces |
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Specification: |
50 pcs/box |
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Sample: |
Able to provide |
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Custom Support: |
Equipment Originator |
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Shape: |
Square, trapezoid |
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Use: |
For fine mirror polishing of products |
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Abrasive: |
Ideal for polishing stainless steel to a mirror or clear finish |
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Supply capacity: |
20000 per month |
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Packaging Details: |
General export packaging |
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Type of packaging: |
Carton |
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Development cycle: |
Ships within 7 days after payment |
Application of Bonding Wax
Silicon based semiconductor wafer processing: Whether it is traditional silicon wafers or large-sized silicon wafers used in advanced processes, semiconductor grinding and polishing quartz wax can be perfectly adapted to meet the full process requirements from rough grinding to fine polishing.
Compound semiconductor material processing: For compound semiconductors such as silicon carbide (SiC), gallium nitride (GaN), etc., due to their high hardness and difficult processing, the unique properties of quartz wax can play a more advantageous role in achieving high-quality grinding and polishing effects.
Pre processing of semiconductor packaging: When grinding and polishing the wafer before the chip packaging process, quartz wax can effectively protect the circuit part of the chip, ensuring the integrity and cleanliness of the chip surface during the packaging process.
Lead time
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Quantity (pieces) |
1 - 100 |
101 - 2000 |
> 2000 |
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Lead time (days) |
7 |
15 |
To be negotiated |
We're well-known as one of the leading bonding wax manufacturers in China. If you're going to buy discount bonding wax, welcome to get pricelist from our factory. Also, customized service is available.
Quartz Wax, ceramic bonding wax, bonding wax