chemical mechanical polishing

The HSM-CMP series is a high-precision lappingand polishing machine developed by HSM for wafer polishing of 4-8 inch STI, ILD/IMD, TSV, TGV materials, as well as wafer surface polishing of compound materials such as SiC, LT, LN, GaAs. It features scientifically reasonable design and advanced performance, with high automation, convenient operation, easy maintenance, and strong reliability. All process parameters can be set through the interactive interface displayed on the touch screen. The key processes of substrate bonding, lappingthinning, chemical mechanical polishing, and front and back inspection of the sample are smoothly and reasonably connected, and the processing dimensions remain consistent. It has multiple access methods and can provide consistent and accurate results during the layering/planarization of semiconductor wafers, chips, or ICs. In addition, the equipment can achieve repeatable results in different quantities of materials through various types of polishing discs, slurries, and polishing pads.
The HSM-CMP series machines can be configured with different hardware and consumables to achieve multiple machine configurations and process solutions to meet various technical requirements for different materials and sizes.

It is widely used in semiconductor material substrate thinning and polishing, device preparation, advanced packaging, MEMS and other related fields, such as TC-SAW, FBAR, lasers, silicon photonic devices, TSV, SIP, Fan-out, MEMS high-temperature pressure sensors, MEMS gyroscopes, etc.

We have formed an installation team composed of experienced technical personnel. This team can ensure the orderly installation of equipment at the customer site. During the on-site installation process, the parameters of the equipment will be tested and adjusted to ensure its normal operation.

Meanwhile, we will randomly provide a content - rich operation manual that elaborates on the various functions and operation processes of the equipment. There are not only paper materials but also installation operation videos to conduct teaching in a vivid and visual way, enabling customers to easily understand the operation of the equipment.

In addition, we offer remote support services. Through remote connection methods, our technical support team can assist customers in diagnosing faults and carrying out simple troubleshooting. Professional customer service staff provide one - on - one technical consulting services to ensure that customers can obtain accurate solutions. In case of emergency, we will give priority to providing services for customers.

As a high-tech enterprise, Hemei Semiconductor has been deeply involved in the field of precision lapping for many years, focusing on the research and development, production, and sales of lapping machines. Adhering to the concept of innovation and quality, Hemei Semiconductor provides high-quality equipment and solutions for the global manufacturing industry.

The core advantages are significant, with a research and development team gathering top talents from multiple fields, large capital investment, holding multiple patents, and promoting technological innovation. The production workshop is equipped with first-class equipment and strictly controls each link according to international standards to ensure product performance and quality.

Excellent product service, rich product line, covering large and small lapping machines, and also providing customized solutions. Pre sales technical consultation, on-time delivery during sales, 24/7 response after sales, providing comprehensive customer service.

Widely cooperating in the market, our products sell well both domestically and internationally, and have a good reputation in the semiconductor industry. We have long-term partnerships with numerous Fortune 500 companies. Collaborate with universities and research institutions to overcome challenges and participate in industry standard setting.

Looking ahead to the future, the company will continue to increase research and development investment, improve product quality, expand global markets, and aspire to become a leader in the industry, supporting the high-quality development of the manufacturing industry.

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