Equipment Parameters
|
Power Supply |
220V 50HZ |
|
Electric Current |
6.3A |
|
Plate diameter |
300mm, 350mm, 420mm |
|
Plate speed |
0-120rpm (range can be adjusted) |
|
Jig rotation speed |
0-120rpm (range can be adjusted) |
|
Work Time |
0-10 hours |
|
Acceptable Wafer Size |
3 inches, 4 inches, 6 inches |
Introduction
Colloidal Silica Polishing Fluid is primarily composed of nano-silica particles made from high-purity silicon powder, water, and various additives. They are widely used for the final surface treatment of materials such as silicon wafers and optical glass.
Features
High Polishing Rate
The mechanical abrasive action of large colloidal silica particles enables rapid polishing.
Uniform Nanoparticles
This polishing fluid contains uniformly sized spherical silica particles (20-100 nanometers), ensuring uniform material removal and a scratch-free surface.
Adjustable pH
The pH of Colloidal Silica Polishing Fluid can be precisely adjusted (typically between 9 and 11) to meet diverse polishing requirements.
Excellent Compatibility
Our products effectively process silicon wafers, sapphire, ceramics, stainless steel, and optical glass, making them suitable for multi-material production environments.
After-sales Service
After the polishing solution is delivered, our technical team provides precise usage guidance for each customer. We focus on the best dilution ratio, application method, and operating standards for different materials such as metal, glass, and stone to ensure optimal results. In metal polishing, we specify the exact ratio, suitable tools, and key techniques to avoid scratches and defects.
We also provide professional operator training. The program includes product chemistry, safety standards, and equipment use. Through on-site demonstrations and video tutorials, operators quickly gain practical skills, improving both efficiency and polishing quality.
Company Introduction
Hemei Semiconductor is a leading supplier of polishing and CMP equipment. The company provides high-performance polishing machines, chemical polishing systems, and CMP tools for global customers.
Its team includes experts in materials, mechanics, and chemistry. With advanced labs and testing facilities, Hemei focuses on improving product precision, stability, and efficiency.
The machines deliver accurate surface finishing for metals, semiconductors, and optical materials. Chemical polishing systems use special formulas and smart controls to reduce material loss and raise yield. CMP tools combine polishing and chemical etching for excellent planarization in semiconductor production.
Hemei's products are used in semiconductors, optics, and metal processing, helping companies improve output and quality.
The company provides complete service support, including a 24/7 hotline, remote assistance, and on-site maintenance and training. Hemei continues to invest in R&D, expand applications, and improve service, working toward global leadership in polishing technology.
FAQ
Q: What advantages does colloidal silica polishing fluid offer compared to traditional abrasives?
A: Colloidal silica provides more uniform polishing results due to its nano-sized spherical particles (20–100 nm). It produces finer surface finishes, fewer scratches, and higher material removal efficiency than alumina or ceria slurries. For buyers, this means less rework, lower consumable usage, and improved process yield.
Q: How stable is the fluid during storage and transportation?
A: It offers excellent suspension stability-particles remain evenly dispersed without sedimentation for over 6–12 months. This allows for longer inventory cycles, reduced waste, and easier long-distance transportation. Stability directly reduces hidden costs in storage and logistics.
Q: Can it be used with different polishing systems or materials?
A: Yes. The fluid's adjustable pH (typically 9–11) and stable chemistry make it suitable for both mechanical and chemical-mechanical polishing (CMP). It performs effectively on silicon wafers, glass, ceramics, metals, and sapphire. This flexibility enables buyers to standardize slurry procurement and simplify supplier management.
Q: What are the cost benefits of using colloidal silica?
A: Although the unit price may be slightly higher than traditional abrasives, the total cost per polished unit is lower. Faster removal rates, reduced defect ratios, and longer shelf life translate into significant savings in production time, material waste, and reprocessing costs.
Q: Is the product environmentally safe and compliant with global regulations?
A: Yes. Colloidal silica polishing fluid is free from heavy metals and toxic components, compliant with RoHS and REACH standards. It is a non-hazardous, water-based formulation that supports sustainable manufacturing and simplifies environmental audit compliance for procurement departments.
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