Lapping is a precision machining method that uses a lapping tool and free abrasives to perform micro-processing on the surface of the workpiece. It reduces surface roughness and improves dimensional and form accuracy, utilizing hard lapping tools. Polishing, on the other hand, is a final surface finishing process that employs finer abrasive particles and soft tools to achieve extremely low surface roughness. However, it does not enhance dimensional or form accuracy and uses soft tools.
This analysis is based on three aspects: processing method, machining precision (surface roughness, dimensional accuracy, and form accuracy), and tool material. Lapping achieves micro-processing through lapping tools and free abrasives, simultaneously improving surface roughness and enhancing dimensional and form accuracy, with hard tools used. Polishing utilizes finer abrasive particles and soft tools, primarily aimed at achieving extremely low surface roughness without improving dimensional or form accuracy, with soft tools employed.
The Precision Lapping and Polishing Machine is a semiconductor wafer flattening equipment used for wafer thinning and polishing, enabling nanoscale planarization of semiconductor materials. As a Chinese manufacturer of precision lapping and polishing machines, our Precision Lapping and Polishing Machine also allows precise control of polishing parameters to achieve customized results.
